Presented at the 1999 Asme International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee
Presented at the 1999 Asme International Mechanical Engineering Congress and Exposition, November 14-19, 1999 , Nashville, Tennessee
Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
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Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
