Engineering Materials and Processes
Devices, Interconnects and Packaging
Engineering Materials and Processes
Devices, Interconnects and Packaging
The fast-developing information technology industry is driving a need for new materials to facilitate the development of more reliable microelectronic products. This book is an overview of current developments and R and D activities in the field of materials used for IT with a focus on future applications.
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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
