Boekhandel Douwes Den Haag

Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Ravich, Joshua & Gayle, Jeremiah & Cepeda-Rizo, Juan

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

 

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.


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Beschrijving Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.


ISBN
9781032160818
Pagina's
290
Verschenen
Serie
Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
NUR
950
Druk
1
Uitvoering
Hardback
Taal
Engels
Uitgever
Taylor & Francis Ltd

Technische wetenschappen