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Boekhandel Douwes Den Haag

IEEE Press

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies

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Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies

IEEE Press

Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies

IEEE Press: Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies

 

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ISBN
9781119314134
Pagina's
576
Verschenen
Serie
IEEE Press
NUR
300
Druk
1
Uitvoering
Hardback
Taal
Engels
Uitgever
John Wiley and Sons Ltd

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This book contains the first systematic exposition of a new discipline called positive topology, which brings many conceptual and mathematical innovations and many benefits for mathematical practice and applications, for the first time extending Darwin's evolutionary vision to the practice of mathematics.

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A comprehensive legal and economic analysis of economic evidence in EU competition law.

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