winkelwagen uitgebreid zoeken
print pagina
Wetenschappen Technische wetenschappen

 

Boekhandel Douwes Den Haag

Introduction to Microsystem Packaging Technology

Jin, Yufeng & Wang, Zhiping & Chen, Jing

Introduction to Microsystem Packaging Technology

Introduction to Microsystem Packaging Technology

Introduction to Microsystem Packaging Technology

 

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective.

Leverbaar

€ 203,20

Langere levertijd

Beschrijving Introduction to Microsystem Packaging Technology

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

ISBN
9781439819104
Pagina's
232
Verschenen
Rubriek
Technische wetenschappen
Druk
1
Uitvoering
Hardback
Taal
Engels
Uitgever
Taylor & Francis Inc

Aerospace Engineering

This Very Short Introduction provides an overview of the concepts involved in the creation of systems that fly. Among the topics discussed are aerodynamics, aircraft structures and materials, aircraft propulsion, flight mechanics, and stability and control.

Peacemaking in a New World

Peacemaking in a New World offers a macro-level perspective on how world orders shape peace processes, arguing that the standard mediation model of 'consent-based conflict resolution', developed in the post-Cold War era, is in crisis.

Modern Residential Construction Practices

Modern Residential Construction Practices provides comprehensive coverage of residential building construction practices that conform to industry standards in the United States and Canada. The second edition features new sections on construction management, construction safety, Building Information Modeling (BIM), and more.

Technische wetenschappen

terug meer